Faculty Directory
Yonggang Huang

Walter P. Murphy Professor of Civil and Environmental Engineering and Mechanical Engineering


2145 Sheridan Road
Evanston, IL 60208-3109

847-467-3165Email Yonggang Huang


Civil and Environmental Engineering

Mechanical Engineering

Materials Science and Engineering


Theoretical and Applied Mechanics Graduate Program

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Ph.D. Engineering Science Harvard University, Cambridge, MA

M.S. Engineering Science Harvard University, Cambridge, MA

B.S. Mechanics Peking University, Beijing, China

Research Interests

Yonggang Huang is the Walter P. Murphy Professor of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering at Northwestern University.  He is interested in mechanics of stretchable and flexible electronics, and deterministic 3D assembly.  He has published 2 books and more than 500 journal papers, including 9 in Science and 3 in Nature.  He is a member of US National Academy of Engineering, a member of European Academy of Sciences and Arts, a foreign member of Academia Europaea, and a foreign member of Chinese Academy of Sciences.  His recent research awards include the Larson Award in 2003, Melville Medal in 2004, Richards Award in 2010, Drucker Medal in 2013 and Nadai Medal in 2016 from the American Society of Mechanical Engineers (ASME); Young Investigator Medal in 2006 and Prager Medal in 2017 from the Society of Engineering Sciences; International Journal of Plasticity Medal in 2007; and Guggenheim Fellowship from the John Simon Guggenheim Foundation in 2008.  He is a Highly Cited Researcher in Engineering (2009-) and a Highly Cited Researcher in Materials Science (2014-).  His recognitions for undergraduate teaching and advising include the Most Supportive Junior Faculty Member from the Department of Aerospace and Mechanical Engineering, University of Arizona in 1993; Engineering Council Award for Excellence in Advising from the College of Engineering, University of Illinois at Urbana-Champaign in 2007; and Cole-Higgins Award for Excellence in Teaching, McCormick School of Engineering, Northwestern University in 2016.  He is the Editor of Journal of Applied Mechanics (Transactions of ASME), a member of the Executive Committee of the ASME Applied Mechanics Division (Chair, 2019-2020), members of the Awards Committee and Nomination Committee of the Engineering Mechanics Institute of American Society of Civil Engineers, and was the President of the Society of Engineering Science in 2014.

Significant Recognition

  • Member, National Academy of Engineering
  • Foreign Member, Academia Europaea
  • Foreign Member, Chinese Academy of Sciences
  • Member, European Academy of Arts and Sciences
  • Bazant Medal, American Society of Civil Engineers, 2018
  • Prager Medal, Society of Engineering Sciences, 2017
  • Nadai Medal, American Society of Mechanical Engineers, 2016
  • Drucker Medal, American Society of Mechanical Engineers, 2013
  • Richards Award, American Society of Mechanical Engineers and Pi Tau Sigma (National Mechanical Engineering Honor Society), 2010
  • Guggenheim Fellowship, John Simon Guggenheim Memorial Foundation, 2008

Significant Professional Service

  • Technical Editor, Journal of Applied Mechanics (ASME Transactions), 2012-
  • Editor in Chief, Theoretical and Applied Mechanics Letters, 2011-

Selected Publications

    1. Khang et al., “A stretchable form of single crystal silicon for high performance electronics on rubber substrates,” Science, v 311, pp 208-212, 2006.
    2. Kim et al., "Stretchable and foldable silicon integrated circuits," Science, v 320, pp 507-511, 2008 (Inner cover feature article).
    3. Ko et al., "A hemispherical electronic eye camera based on compressible silicon optoelectronics," Nature, v 454, pp 748-753, 2008 (cover feature article).
    4. Park et al., "Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays," Science, v 325, pp 977-981, 2009.
    5. Rogers JA, Someya T, and Huang Y, "Materials and mechanics for stretchable electronics," Science, v 327, pp 1603-1607, 2010 (review article).
    6. Kim et al., "Epidermal electronics," Science, v 333, pp 838-843, 2011.
    7. Hwang et al., “A physically transient form of silicon electronics,” Science, v 337, pp 1640-1644, 2012 (cover feature article).
    8. Kim et al., “Injectable, cellular-scale optoelectronics with applications for wireless optogenetics,” Science, v 340, pp 211-216, 2013.
    9. Song et al., “Digital cameras with designs inspired by the arthropod eye,” Nature, v 497, pp 95-99, 2013 (cover feature article).
    10. Xu et al., “Soft microfluidic assemblies of sensors, circuits and radios for the skin,” Science, v 344, pp 70-74, 2014.
    11. Xu et al., “Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling,” Science, v 347, pp 154-159, 2015. (cover feature article)
    12. Kang et al., “Bioresorbable silicon sensors for the brain,” Nature, v 530, pp 71-76, 2016.